This module covers wire bonding, Tape Automated Bonding (TAB), and flip-chip technologies. Students will understand the techniques used for connecting chips to substrates and the advantages and challenges associated with each method.
This module introduces students to the course objectives and sets the foundation for understanding the multidisciplinary nature of electronics systems packaging. Students will learn about the significance of packaging in electronic systems and its impact on performance and reliability.
This module delves into the definition of a system and provides a historical context regarding the evolution of semiconductors. Students will gain insights into how semiconductor technology has shaped modern electronics and the role of systems packaging within this landscape.
This module focuses on various products and levels of packaging within electronics. Students will learn about the different types of packaging used in microelectronic devices and how these packages vary at the chip, board, and system levels.
This module examines the packaging aspects of handheld products through case studies. Students will analyze real-world applications, gaining practical insights into the challenges and solutions in packaging design for portable electronics.
This module continues the case study discussion and introduces the definition of Printed Wiring Board (PWB). Students will summarize key points and engage in review questions to reinforce their learning about PWBs and their importance in electronics packaging.
This module covers the basics of semiconductor technology and presents a process flowchart illustrating the steps involved in semiconductor manufacturing. A video titled "Sand-to-Silicon" will enhance understanding by visually depicting the journey from raw materials to finished semiconductor products.
This module explores the wafer fabrication process, including inspection and testing methods. Students will gain an understanding of the critical steps involved in producing semiconductor wafers and the importance of quality control throughout the fabrication process.
This module focuses on wafer packaging and the evolution of packaging technologies. Students will learn about various chip connection choices and how advancements in packaging have influenced the performance and reliability of electronic devices.
This module covers wire bonding, Tape Automated Bonding (TAB), and flip-chip technologies. Students will understand the techniques used for connecting chips to substrates and the advantages and challenges associated with each method.
This module continues the discussion on wire bonding, TAB, and flip-chip technology, providing tutorials to reinforce the concepts learned. Students will engage in practical exercises to deepen their understanding of these critical packaging technologies.
This module addresses the necessity of packaging, focusing on single chip packages or modules (SCM). Students will learn about the advantages of SCMs and their applications in modern electronics, highlighting their role in enhancing performance.
This module covers commonly used packages and advanced packaging techniques, exploring the materials utilized in these packages. Students will gain insights into how material selection impacts the performance and reliability of electronic devices.
This module continues the discussion on advanced packaging techniques, examining thermal mismatch issues and current trends in packaging. Students will learn about design considerations and solutions to thermal challenges in electronics packaging.
This module introduces multichip modules (MCM) and their types, as well as the concept of System-in-Package (SiP). Students will learn about the benefits of integrating multiple chips into a single package and the implications for system design.
This module addresses various electrical issues related to electronics packaging, focusing on resistive parasitics. Students will learn about the impact of parasitic elements on circuit performance and methods to mitigate these effects.
This module continues the discussion on electrical issues, focusing on capacitive and inductive parasitics. Students will understand how these parasitics affect signal integrity and performance in electronic systems.
This module further discusses electrical issues in packaging, emphasizing layout guidelines and the reflection problem. Students will learn about best practices for circuit layout to minimize reflection and enhance performance.
This module addresses interconnection issues in electrical packaging. Students will learn about different interconnection techniques and their implications for performance, reliability, and manufacturability in electronic systems.
This module provides a quick tutorial on packaging, highlighting the benefits of Computer-Aided Design (CAD) in the design process. Students will be introduced to Design for Manufacturing (DFM), Design for Reliability (DFR), and Design for Testing (DFT) concepts.
This module discusses the components of a CAD package and highlights its key features. Students will learn how CAD tools facilitate the design process and improve efficiency in electronics packaging.
This module focuses on design flow considerations, guiding students through the initial stages of circuit design using schematic work. Students will learn how to approach circuit design methodically and effectively.
This module provides demonstrations and examples of layout and routing techniques. Students will explore technology file generation from CAD and its significance in ensuring proper design implementation.
This module reviews CAD output files essential for PCB fabrication. Students will learn about photo plotting and mask generation processes, which are critical steps in the manufacturing process of Printed Circuit Boards.
This module presents a process flowchart for PCB manufacturing, covering essential elements such as vias and PWB substrates. Students will understand the steps required to produce high-quality printed circuit boards.
This module continues the discussion on substrates, providing video highlights and focusing on surface preparation techniques essential for PCB manufacturing. Students will learn about the importance of proper preparation for successful PCB fabrication.
This module covers photoresist application methods, UV exposure, and developing processes used in PCB manufacturing. Students will learn about the significance of photoresist techniques in achieving accurate circuit patterns.
This module discusses PWB etching, resist stripping, and screen-printing technology. Students will understand the processes involved in these essential PCB manufacturing techniques and their importance in achieving high-quality electrical connections.
This module covers through-hole manufacture process steps, including panel and pattern plating methods. Students will learn about the techniques used to create reliable connections in printed circuit boards.
This module highlights video presentations on manufacturing processes, including solder mask application for PWBs and the construction of multilayer PWBs. Students will gain insights into advanced PWB designs and their advantages.
This module focuses on microvia technology and the Sequential Build-Up Technology (SBU) process flow for high-density interconnections. Students will understand how these technologies enhance miniaturization in electronics packaging.
This module contrasts conventional and high-density interconnect (HDI) technologies, discussing flexible circuits. Students will explore the advantages of HDI technologies and their implications for modern electronics packaging.
This module discusses the benefits of Surface Mount Devices (SMD) and associated design issues, introducing students to soldering techniques. Students will learn about the advantages of SMD in modern electronic designs.
This module explores reflow and wave soldering methods for attaching SMDs. Students will learn about the significance of these soldering techniques in ensuring reliable connections in electronic assemblies.
This module discusses solder types, including their wetting properties, flux characteristics, and common defects in wave soldering. Students will gain insights into how these factors affect soldering quality and reliability.
This module covers vapor phase soldering, Ball Grid Array (BGA) soldering, and desoldering/repair techniques. Students will learn about the challenges and solutions in these soldering methods to maintain assembly integrity.
This module discusses the SMT failure library and the phenomenon of tin whiskers. Students will learn about common soldering failures and strategies to mitigate risks associated with tin whiskers in electronic assemblies.
This module covers lead-free solder considerations, phase diagrams, and thermal profiles for reflow soldering. Students will learn about industry trends towards lead-free soldering and its implications for electronics packaging.
This module discusses lead-free solder considerations, green electronics, RoHS compliance, and e-waste recycling issues. Students will understand how these factors influence modern electronics manufacturing and packaging practices.
This module focuses on thermal design considerations in systems packaging. Students will understand the importance of thermal management in electronic systems and learn strategies to optimize thermal performance.
This module introduces embedded passives, discussing the need for these components in modern electronics. Students will learn about the design library associated with embedded capacitors and their applications in various circuit designs.
This module covers embedded capacitors, including the processes for embedding these components into printed circuit boards. Students will review case study examples highlighting the advantages and challenges associated with embedded capacitors in designs.
This module provides a chapter-wise summary of the course, consolidating key concepts and learnings throughout the course. Students will have the opportunity to reflect on their learning and clarify any remaining questions.